Substrate for X-Ray Detector
Material: Al-Si Alloys
ZKZY adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.
Technical Specifications
Comprehensive data measured under standard laboratory conditions.
Product Description
» Substrate for X-Ray detector
Selectable Silicon Aluminum(Si/Al) Alloys
» AlSi70(Si-30%Al controlled expansion alloy)
Beneficial Properties
» High thermal conductivity;» Low CTE match to CMOS components;
» Possess higher stiffness compared with other commonly used materials;
» Competitive cost;
» Dimensional stability,flatness.
AlSi Alloys Performance Parameters
| Content wt% |
Density g/cm³ |
CTE 25℃ ppm/℃ |
Thermal Conductivity 25℃ W/mK |
Tensile Strength MPa |
Yield Strength MPa |
Poisson's Ratio |
Elongation % |
Elastic Modulus GPa |
| Al-20%Si | 2.40 | 6 | 110 | 125 | 125 | -- | -- | 132 |
| Al-27%Si | 2.6 | 17 | 175 | 170 | 130 | 0.29 | 3.8 | 91 |
| Al-30%Si | 2.43 | 7.5 | 120 | 138 | 138 | 0.25 | ＜1 | 131 |
| Si-40%Al | 2.46 | 9 | 125 | 181 | 181 | 0.27 | ＜1 | 121 |
| Si-42%Al | 2.55 | 13.5 | 143 | 200 | 187 | 0.29 | 1 | 105 |
| Si-50%Al | 2.5 | 11.5 | 140 | 200 | 210 | 0.28 | ＜1 | 108 |
| Grade | Density g/cm³ |
CTE ppm/℃ |
Thermal Conductivity W/mK |
Tensile Strength MPa |
Yield Strength MPa |
Poisson's Ratio |
Elongation % |
Elastic Modulus GPa |
| ZY-4047 | 2.66 | 21.6 | 193 | 208 | 129 | 0.33 | 18 | 70 |
| ZY-6061 | 2.7 | 22.6 | 210 | 312 | 270 | 0.33 | 12.5 | 69 |
Related Solutions
Complementary material systems commonly specified with the ZK-AlSi50 series.
Electronic package cover plate
We offer the Al-Si controlled expansion alloy with low density,higher thermal conductivity and a controlable coefficient of thermal expansion(CTE) ranging between 7ppm/℃ and 17ppm/℃.
Density(at 20℃)
2.6g/cm3
Yield strength
130Mpa
Tensile strength
170MPa
Fiber Optic & Telecom Packages
Material: Silicon Aluminum Alloys(AlSi Alloys)
ZKZY adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.
