Electronic package cover plate
We offer the Al-Si controlled expansion alloy with low density,higher thermal conductivity and a controlable coefficient of thermal expansion(CTE) ranging between 7ppm/℃ and 17ppm/℃.
Quick Specifications
Technical Specifications
Comprehensive data measured under standard laboratory conditions.
Advanced electronic packaging materials can be produced by ZKZY's rapid solidified technology,such as the main alloy product Al-27Si controlled expansion alloy.It can be widely used as carrier plates in electronic and defense industries.
We also offer the raw material of Controlled expansion Si-Al alloy(Al-27%Si alloy) from semi-finished machined parts to machined final products. What’s more,the alloy is suitable for standard welding,such as electron beam welding,laser welding and etc.
Product Description:
Grade Name: Al-27Si controlled expansion alloy
Main composition: Al - 27%wt Si
Welding process: electron beam welding,laser welding
Tensile strength: 170MPa
Yield strength: 130Mpa
Density(at 20℃): 2.6g/cm3
Specific heat capacity(metric system): 0.8465J/g-℃
Poisson’s ratio: 0.29
Elongation: 3.8%
Elastic modules: 91GPa
Annual export capacity: 10,000tons
Trade terms: EXW(Ex-work),FOB,CIF
Terms of payment: T/T preferred
Related Solutions
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ZKZY adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.
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Material: Silicon Aluminum Alloys(AlSi Alloys)
ZKZY adopts rapid solidification and subsequent machining technology, offering a series of electronic packaging services,including R&D,production,subsequent machining and plating.
